3M Polyimide Tape
Our polyimide tape (brand name: Kapton) – models include KA06F30, KA06D, and KA06F30-ESD – is a high-performance engineering material. Compared to 3M silicone tape, 3M acrylic tape, and 3M anti-static tape, our product offers superior cost-effectiveness. Unlike ordinary adhesive/low-temperature masking tapes, it maintains its integrity, strength, and electrical properties under conditions where other plastics/adhesives would degrade. Key features include: extremely high heat resistance (over 260°C), excellent electrical insulation properties, and outstanding chemical resistance. It is ideal for printed circuit board wave soldering masking, high-performance motor coil insulation, and aerospace/low-temperature component protection.
Product Selling Points
- Versatile Applications: Ideal for PCB production, electronic component protection, 3D printing, laser cutting, and high-temperature industrial operations.
- Cost-Effective Alternative to Imported Brands: Comparable performance to international brands at competitive pricing.
- Customizable: Available in various widths, thicknesses, and lengths for bulk orders.
- Fast Delivery: Factory direct supply with ample stock, supporting large orders.
- Certified Quality: ISO and UL certified, ensuring safe and reliable performance.
Polyimide tape Series Specification Sheet-KA06F30
| Effective Width (mm) | Based on actual shipment specifications | ||
| Item | Unit | Spec | Test Method |
| Product Dimension | |||
| 1. Color | – | Brown | – |
| 2. Thickness | mm | 0.057±0.002 | GB/T 7125-1999 |
| 3. Inside Diameter of Roll | mm | 77±1 | – |
| 4. Length | m | Customized | – |
| Product Design | |||
| 1. Backing | – | PI | – |
| 2. Backing Thickness | mm | 0.025 | GB/T 7125-1999 |
| 3. Adhesive | – | silica gel | – |
| Technical Data | |||
| 1. 180° Peel adhesion | N/25mm | ≥8 | GB/T 2792-1998 |
| 2. Holding Power | hr | ≥4 | GB/T 4851-1998 |
| 3. Tensile strength | MPa | ≥60 | GB/T 7753-87 |
| 4. Elongation | % | ≥20 | GB/T 7753-87 |
| 5. Temperature resistance | 260℃/30mins | No residual glue | / |
Polyimide tape Series Specification Sheet-KA06D
| Effective Width (mm) | Based on actual shipment specifications | ||
| Item | Unit | Spec | Test Method |
| Product Dimension | |||
| 1. Color | – | Brown | – |
| 2. Thickness | mm | 0.065±0.005 | GB/T 7125-1999 |
| 3. Inside Diameter of Roll | mm | 77±1 | – |
| 4. Length | m | Customized | – |
| Product Design | |||
| 1. Backing | – | PI | – |
| 2. Backing Thickness | mm | 0.05 | GB/T 7125-1999 |
| 3. Adhesive | – | Acrylic | – |
| Technical Data | |||
| 1. 180° Peel adhesion | N/25mm | 2.0-6.0 | GB/T 2792-1998 |
| 2. Temperature resistance | 260℃/30mins | No adhesive residues | / |
Polyimide tape Series Specification Sheet-KA06F30-ESD
| Effective Width (mm) | Based on actual shipment specifications | ||
| Item | Unit | Spec | Test Method |
| Product Dimension | |||
| 1. Color | – | Brown | – |
| 2. Thickness | mm | 0.057±0.002 | GB/T 7125-1999 |
| 3. Inside Diameter of Roll | mm | 77±1 | – |
| 4. Length | m | Customized | – |
| Product Design | |||
| 1. Backing | – | PI | – |
| 2. Backing Thickness | mm | 0.025 | GB/T 7125-1999 |
| 3. Adhesive | – | silica gel | – |
| Technical Data | |||
| 1. 180° Peel adhesion | N/25mm | ≥8 | GB/T 2792-1998 |
| 2. Holding Power | hr | ≥4 | GB/T 4851-1998 |
| 3. Tensile strength | MPa | ≥60 | GB/T 7753-87 |
| 4. Elongation | % | ≥20 | GB/T 7753-87 |
| 5. Temperature resistance | 260℃/30mins | No residual glue | / |
| 6. Volume Resistance | Ω | 10⁶-10⁹ | / |
Customizable styles

1. Polyimide CIRCLES
Primarily used for localized masking and protection in electronic manufacturing, such as:
- precise masking during PCB wave soldering and gold finger spraying (to prevent solder joints/gold fingers from being contaminated);
- protection of specific areas in high-temperature spraying processes (high temperature resistance, easy peeling, and no residue).

2. Polyimide rectangular
It belongs to the category of die-cut custom shapes and is commonly used for:
- fixing and insulating the positive/negative tabs of lithium batteries;
- component masking in SMT (Surface Mount Technology) processes;
- partial insulation wrapping of motor and transformer coils.

3. Polyimide Rolls
Supplied in roll form, suitable for large-area/continuous processing scenarios:
- Coil insulation wrapping for motors and transformers (resistant to high and low temperatures, high insulation level);
- Substrate for flexible printed circuits (FPC);
- High-temperature insulating sleeves for cables.

4. Polyimide Sheets
Suitable for large-area/custom-size insulation/substrate needs:
- Encapsulation substrates for high-temperature heating films (such as heating elements in aerospace/medical equipment);
- Sample support films for X-ray fluorescence spectroscopy (XRF) analysis;
- Structural support and overall protection of gold fingers for flexible circuit boards.
Our Production Equipment
Jiujiang Leadcomp Co., Ltd. has many years of experience in the manufacturing of high-temperature tapes. Our factory is equipped with advanced slitting, die-cutting, and coating equipment, enabling large-scale, precise, and high-quality production. Each roll of tape undergoes rigorous quality control to ensure its reliability and consistency in industrial applications.
Customer Success Stories
Jiujiang Leadcomp Co., Ltd. provides high-quality ODM and OEM tape solutions for numerous industries, customizing die-cut tape products to meet each customer’s unique needs. With years of experience in precision die-cutting, we pride ourselves on advanced processes and attention to detail. The following showcases our superior die-cutting technology and samples, reflecting our relentless pursuit of quality and precision.
































