ESD Polyimide Tape
A specialized protective material for the electronics industry. It combines polyimide (PI) film’s high-temperature resistance/insulation with ESD functionality—shielding sensitive electronics from static damage while enduring harsh production environments.
Core Features and Advantages
- Extreme Thermal Endurance: Withstands continuous temps over 260°C(500°F), ideal for reflow soldering/high-heat scenes.
- ESD Protection: Dissipates static charges to guard delicate electronic components.
- Superior Electrical Insulation: Maintains strong dielectric strength, fit for PCB/battery tab insulation.
- High Durability: Resists chemicals, abrasion & tearing for long-term industrial reliability.
- Precision Design: Thin yet robust, suitable for delicate tasks like flexible circuit bonding.
Product Selling Points
1. Substrate + Dual-Effect Antistatic Protection
- PI substrate: Withstands 260℃ high temperatures, high insulation (dielectric strength ≥120kV/mm)
- Paired with antistatic coating/adhesive layer: Surface resistance 10⁶–10⁹Ω, peeling electrostatic voltage ≤50V; prevents ESD damage to chips/FPCs during unwinding/peeling
- Antistatic layer preserves PI’s chemical/radiation resistance & high mechanical strength; withstands harsh conditions (e.g., SMT reflow soldering) with long-term stable resistance
2. Precision Bonding + Residue-Free · Mass Production Compatible
- Uniform adhesive layer (controllable adhesion): Precisely bonds to PCB gold fingers/battery tabs; residue-free after removal (avoids contamination/short circuits)
- Supports die-cut customization + automated placement; achieves antistatic/insulation/shielding in one step, boosting efficiency & cutting costs
3. Extreme Environment Stability · High-End Application Compatible
- Stable performance across -50℃ to 260℃+; resistant to acids/alkalis/solvents/damp-heat aging (suitable for new energy batteries/avionics)
- Complies with RoHS/REACH standards; no corrosive ions, ensuring long-term product reliability
ESD Polyimide Tape Series Specification Sheet
| Effective Width (MM) | Subject to actual shipment specifications | ||||||
|---|---|---|---|---|---|---|---|
| ITEM UNIT | KA08F7-ESD | KA06F30-ESD | KAO5F15-ESD | KA04F17-ESD | KA03F11-ESD | TEST METHOD | |
| Dimension & Tolerances / Product Dimension | |||||||
| 1. Color | Brown | Brownish gray | Brown | Brown | Brown | ||
| 2. Thickness (MM) | 0.090±0.005 | 0.057±0.002 | 0.050±0.005 | 0.040±0.002 | 0.038±0.005 | GB/T 7125-1999 | |
| 3. Inside Diameter of Roll (MM) | 77±1 | 77±1 | 77±1 | 77±1 | 77±1 | ||
| 4. Length (M) | 100 | Customized | 100 | Customized | 100 | ||
| Composition / Product Design | |||||||
| 1. Backing | PI | PI | PI | PI | PI | ||
| 2. Backing Thickness (MM) | 0.050 | 0.025 | 0.025 | 0.025 | 0.025 | GB/T 7125-1999 | |
| 3. Adhesive | Silica gel | Silica gel | Silica gel | Silica gel | Silica gel | ||
| Physical & Chemical Properties / Technical Data | |||||||
| 1. Tack (N/24MM) | ≥1 | ≥1 | ≥2 | GB/T 3125-2014 | |||
| 2. 180° Peel adhesion (N/25MM) | ≥3 | ≥8 | ≥5 | ≥3 | ≥1 | GB/T 2792-1998 | |
| 3. Holding Power (Hr) | ≥4 | ≥4 | ≥12 | >12 | ≥4 | GB/T 4851-1998 | |
| 4. Tensile Strength (MPa) | ≥70 | ≥60 | ≥70 | ≥60 | ≥70 | GB/T 7753-87 | |
| 5. Elongation (%) | ≥50 | ≥20 | ≥35 | ≥20 | ≥60 | GB/T 7753-87 | |
| 6. Volume Resistance (Ω) | 10⁶-10⁹ | 10⁶-10⁹ | 10⁶-10⁹ | 10⁶-10⁹ | 10⁶-10⁹ | GB/T 1410 | |
| 7. Temperature resistance (℃) | 260°C (0.5h no residual glue) | 200°C/30mins (No residual glue) | 260°C (0.5h no residual glue) | 260°C /30mins (No residual glue) | 260°C (0.5h no residual glue) | ||
Customizable styles
1. Polyimide CIRCLES
Primarily used for localized masking and protection in electronic manufacturing, such as:
- precise masking during PCB wave soldering and gold finger spraying (to prevent solder joints/gold fingers from being contaminated);
- protection of specific areas in high-temperature spraying processes (high temperature resistance, easy peeling, and no residue).
2. Polyimide rectangular
It belongs to the category of die-cut custom shapes and is commonly used for:
- fixing and insulating the positive/negative tabs of lithium batteries;
- component masking in SMT (Surface Mount Technology) processes;
- partial insulation wrapping of motor and transformer coils.
3. Polyimide Rolls
Supplied in roll form, suitable for large-area/continuous processing scenarios:
- Coil insulation wrapping for motors and transformers (resistant to high and low temperatures, high insulation level);
- Substrate for flexible printed circuits (FPC);
- High-temperature insulating sleeves for cables.
4. Polyimide Sheets
Suitable for large-area/custom-size insulation/substrate needs:
- Encapsulation substrates for high-temperature heating films (such as heating elements in aerospace/medical equipment);
- Sample support films for X-ray fluorescence spectroscopy (XRF) analysis;
- Structural support and overall protection of gold fingers for flexible circuit boards.
Industries We Serve
Widely used in electronics, automotive, construction, home appliances, packaging, and furniture manufacturing, ensuring strong bonding and reliable performance across industries.
Our Production Equipment
Jiujiang Leadcomp Co., Ltd. has many years of experience in the manufacturing of high-temperature tapes. Our factory is equipped with advanced slitting, die-cutting, and coating equipment, enabling large-scale, precise, and high-quality production. Each roll of tape undergoes rigorous quality control to ensure its reliability and consistency in industrial applications.
Customer Success Stories
Jiujiang Leadcomp Co., Ltd. provides high-quality ODM and OEM tape solutions for numerous industries, customizing die-cut tape products to meet each customer’s unique needs. With years of experience in precision die-cutting, we pride ourselves on advanced processes and attention to detail. The following showcases our superior die-cutting technology and samples, reflecting our relentless pursuit of quality and precision.
Our Certificates
