LED digitron tape

LED packaging high temperature tape is professionally used for packaging and protection of LED digital tubes, flat tubes, and dot matrix modules

Production Process Flow

From raw materials to finished product, every step is rigorously controlled to ensure consistent and reliable performance.

  • Corona Treatment: Increases the surface tension of plastic films (such as PI and PET) and enhances adhesive adhesion.
  • Plasma Cleaning: Used for cleaning and activating ultra-thin substrates (such as PI films).
  • Transfer Coating Method:
    1. Glue is first applied to the release film and then transferred to the substrate after drying (control the adhesive layer thickness to 5-20μm).
    2. Suitable for high-precision tapes (such as LED chip mounting tapes).
  • Direct Coating Method: Glue is applied directly to the substrate, suitable for thick adhesive layers (such as thermal conductive tapes).
  • Drying Process: Dry in stages from 80°C to 120°C to 150°C to avoid solvent residue.
  • Functional Layer Lamination:
  • Thermal conductive tapes require lamination with a metal foil (such as copper foil) or ceramic fiber layer.
  • Transparent tapes require lamination with an optical-grade release film (light transmittance > 87%). – Heat Curing: Silicone systems require a secondary cure at 150-180°C (to improve heat resistance).
LED-bright-surface-high-temperature-tape

LED bright surface high-temperature tape

LED matte surface high-temperature tape

LED digitron tape Series Specification Sheet

 

Name ltem No.Model Colour standard size Tack Adhesion Strength Tensile Resistance Temperature tolerance
thick/mm wide/mm long/m N N/25mm N/25mm ℃
LED bright surface high-temperature tape MY68C Transparent 0.057 1000 33/66 3↑ 7↑ 150↑ 200
LED matte surface high-temperature tape MY68W White 0.065 1000 33/66 3↑ 6↑ 150↑ 100
LED matte surface high-temperature tape MY12C White 0.085 1000 33/66 2↑ 2↑ 150↑ 130

Technology Showdown: Tape vs. Gaskets

When it comes to sealing and protecting components in LED packaging, manufacturers typically choose between two main options: LED digitron tape and pre-formed gaskets. While both serve a similar purpose, their technical characteristics create significant differences in production efficiency, flexibility, and overall cost.

LED Digitron Tape

  • High Flexibility: A single roll of tape can be adapted to various component sizes. This versatility dramatically simplifies inventory, as there’s no need to stock multiple sizes of pre-cut seals.

  • Automation-Friendly: The tape is designed for use with automated dispensing and packaging machinery, allowing for a smooth, efficient, and continuous production line.

  • Superior Shrinkage Handling: It effectively accommodates the natural shrinkage of materials during the manufacturing process, which reduces the risk of components shifting and causing optical defects.

  • Lower Overall Cost: By enabling more precise dispensing of materials and simplifying inventory, adhesive tape helps lower the total cost of production.

  • Single-Use: Its primary drawback is that it is a consumable product and must be continuously replenished.

Pre-formed Gasket

  • Reusable: Gaskets can be used multiple times, which can be an advantage in certain processes, although they require cleaning between uses.

  • Low Flexibility: Each unique component shape requires a custom-sized gasket. This rigidity leads to a complex and costly inventory with many different SKUs (Stock Keeping Units).

  • Complex Automation: Integrating gaskets into an automated line is challenging, often requiring precise and expensive pick-and-place robots and frequent tool changes for different gasket sizes.

  • Shrinkage Risk: The gasket itself can introduce shrinkage issues early in the process, potentially leading to misaligned optics and product failure.

Functions, Uses, and Applications

LED packaging high-temperature tape is a critical consumable in the optoelectronics industry. Its core function is to provide precise masking and protection during die-attach, phosphor molding, and curing processes.

Die-Attach Masking

Protects designated areas of the lead frame from contamination by conductive silver epoxy or insulating adhesive during the LED die-attach process.

Phosphor Molding

Acts as part of the mold, providing isolation and shaping during phosphor coating and compression molding to ensure consistent light color.

Substrate Handling

Provides a temporary carrier and transfer substrate for micro-chips like Mini/Micro-LEDs, facilitating high-precision mass transfer operations.

Primary Application Fields

Our product is suitable for various LED packaging processes, especially in production lines requiring high reliability and precision:

  • SMD LED Manufacturing: Used in the automated packaging of Surface-Mount Device LEDs (e.g., 2835, 5050).
  • COB LED Modules: For damming and masking in Chip-on-Board packaging.
  • High-Power LEDs: For ceramic substrate packaging that requires higher heat and chemical resistance.
  • Mini / Micro-LED Displays: Used for temporary fixing and protection during mass transfer and repair processes.

Quality Standards & Certifications

We are committed to delivering the highest quality products, a promise backed by strict internal standards and authoritative third-party certifications.

Appearance Standard

Tape surface is smooth and free of defects like bubbles, scratches, or impurities. Edges are clean with no adhesive bleed.

Performance Consistency

Each batch is tested for key performance indicators like peel strength to ensure stable and reliable performance.

Dimensional Tolerance

Strict control over width and thickness tolerances ensures high consistency for automated production lines.

Third-Party Inspection & Certification

ISO 9001:2015

Quality Management System certification, demonstrating our ability to consistently produce high-quality products.

RoHS Directive

Products are free of hazardous substances, complying with EU environmental standards for user and environmental safety.

REACH Regulation

Compliant with EU chemical regulations, ensuring a high level of protection for human health and the environment.