Polyimide tape
Polyimide tape is a critical, high-performance material known best by the trade name Kapton.Unlike ordinary tapes designed for bonding or low-temperature masking, polyimide tape is anengineered polymer designed to maintain its integrity, strength, and electrical properties underconditions that would instantly melt, brittle, or degrade almost any other plastic or adhesive. itskey properties include extreme thermal endurance (withstanding temperatures well over260°C), superior electrical insulation (high dielectric strength), and exceptional chemicalresistance. These characteristics make it indispensable for applications such as maskingprinted circuit boards (PCBs) during wave soldering, insulating coils in high-performancemotors, and protecting components in aerospace and cryogenic systems.
Production Process Flow
From raw materials to finished product, every step is rigorously controlled to ensure consistent and reliable performance.

KA08F7

KA06F30

KA04F17

KAO5F15

KA03F11
Polyimide tape Series Specification Sheet
| Effective Width (MM) | Subject to actual shipment specifications | ||||||
|---|---|---|---|---|---|---|---|
| ITEM UNIT |
KA08F7 | KA06F30 | KA04F17 | KAO5F15 | KA03F11 | TEST METHOD | |
| Dimension & Tolerances / Product Dimension | |||||||
| 1. Color | Brown | Brownish gray | Brown | Brown | Brown | ||
| 2. Thickness (MM) |
0.090±0.005 | 0.057±0.002 | 0.040±0.002 | 0.050±0.005 | 0.038±0.005 | GB/T 7125-1999 | |
| 3. Inside Diameter of Roll (MM) |
77±1 | 77±1 | 77±1 | 77±1 | 77±1 | ||
| 4. Length (M) |
100 | Customized | Customized | 100 | 100 | ||
| Composition / Product Design | |||||||
| 1. Backing | PI | PI | PI | PI | PI | ||
| 2. Backing Thickness (MM) |
0.050 | 0.025 | 0.025 | 0.025 | 0.025 | GB/T 7125-1999 | |
| 3. Adhesive | Silica gel | Silica gel | Silica gel | Silica gel | Silica gel | ||
| Physical & Chemical Properties / Technical Data | |||||||
| 1. Tack (N/24MM) |
≥1 | ≥1 | ≥2 | GB/T 3125-2014 | |||
| 2. 180° Peel adhesion (N/25MM) |
≥3 | ≥8 | ≥3 | ≥5 | ≥1 | GB/T 2792-1998 | |
| 3. Holding Power (Hr) |
≥4 | ≥4 | >12 | ≥12 | ≥4 | GB/T 4851-1998 | |
| 4. Tensile Strength (MPa) |
≥70 | ≥60 | ≥60 | ≥70 | ≥70 | GB/T 7753-87 | |
| 5. Elongation (%) |
≥50 | ≥20 | ≥20 | ≥35 | ≥60 | GB/T 7753-87 | |
| 6. Temperature resistance (℃) |
260°C (0.5h no residual glue) | 200°C/30mins (No residual glue) | 260°C /30mins (No residual glue) | 260°C (0.5h no residual glue) | 260°C (0.5h no residual glue) | ||
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KA06D25

KA03D34

KA04D19
Technology Showdown: Polyimide Tape vs. Ordinary Tape
The primary alternative to polyimide tape in many bonding/insulating tasks is ordinary tape (e.g., PVC, general adhesive tape). While both fulfill basic adhesion or insulation needs, their differences in thermal endurance, reliability, and precision profoundly impact performance in electronic and industrial applications.
Functions, Uses, and Applications
Polyimide tape is an indispensable material in electronic manufacturing. Its core function is to ensure reliability and performance of electronic components via excellent thermal resistance, insulation, and adhesion throughout complex production workflows.

Quality Standards & Certifications
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