Silicone polyimide tape
PI substrate + silicone PSA, slit after lamination. Core: ultra-high-temp/wide temp adaptability + insulation. Key for motor insulation/electronic high-temp processes (gold finger/high-temp PI tape).
Core Features
- Temp Stability: -60℃~260℃ (long-term), 300℃+ (short-term); no softening, dimensional stability.
- H-Class Insulation: ≥6.5kV dielectric strength, ≥10¹³Ω・cm volume resistivity; flame-retardant.
- Adhesion: Wide temp range, low-temp flexibility, residue-free after high-temp peeling.
- Resistance: Weak acids/bases/solvents/radiation; stable in humid/vacuum/outdoor conditions.
- Process-Friendly: Easy die-cut/apply; fits automated lines (high-temp masking/fixing).
- Silicone Adhesive Note: Good initial adhesion; long-term high-temp strength loss—avoid silicone-sensitive processes.
Product Selling Points
1. Dual Temp Breakthroughs for Extreme Conditions
- 260℃ long-term / 300℃+ short-term resistance (exceeds acrylic’s 175℃ limit); stable for ultra-high-temp curing/wafer dicing.
- 73℃ low-temp flexibility (no brittleness); fits alternating high-low temp environments (e.g., aerospace electronics).
2. Adhesion to Low Surface Energy Substrates
- Bonds firmly to PTFE/fluoropolymer coatings/silicone rubber (acrylic’s limitation).
- Strong initial tack + wide-temp stable adhesion; overcomes acrylic’s 0-100℃ medium-temp focus.
3. Extreme Environment Stability
- Superior radiation/weather resistance; slow degradation in vacuum/strong UV/humid heat (aerospace/nuclear suitable).
- Resists polar solvents; maintains structure in chemical environments (complements acrylic’s weak acid/base resistance).
Silicone-based Polyimide Tape Specification Sheet
| Effective Width (MM) | Subject to actual shipment specifications | ||||||
|---|---|---|---|---|---|---|---|
| ITEM UNIT |
KA03F11 | KA04F17 | KA05F15 | KA06F30 | KA08F7 | TEST METHOD | |
| Dimension & Tolerances / Product Dimension | |||||||
| 1. Color | Amber | Amber | Amber | Amber | Amber | ||
| 2. Thickness (MM) |
0.038±0.005 | 0.040±0.002 | 0.050±0.005 | 0.057±0.002 | 0.090±0.005 | GB/T 7125-1999 | |
| 3. Inside Diameter of Roll (MM) |
77±1 | 77±1 | 77±1 | 77±1 | 77±1 | ||
| 4. Length (M) |
100 | Customized | 100 | Customized | 100 | ||
| Composition / Product Design | |||||||
| 1. Backing | PI | PI | PI | PI | PI | ||
| 2. Backing Thickness (MM) |
0.025 | 0.025 | 0.025 | 0.025 | 0.050 | GB/T 7125-1999 | |
| 3. Adhesive | Silica gel | Silica gel | Silica gel | Silica gel | Silica gel | ||
| Physical & Chemical Properties / Technical Data | |||||||
| 1. Tack (N/24MM) |
≥2 | ≥1 | ≥1 | GB/T 3125-2014 | |||
| 2. 180° Peel adhesion (N/25MM) |
≥1 | ≥3 | ≥5 | ≥8 | ≥3 | GB/T 2792-1998 | |
| 3. Holding Power (Hr) |
≥4 | >12 | ≥12 | ≥4 | ≥4 | GB/T 4851-1998 | |
| 4. Tensile Strength (MPa) |
≥70 | ≥60 | ≥70 | ≥60 | ≥70 | GB/T 7753-87 | |
| 5. Elongation (%) |
≥60 | ≥20 | ≥35 | ≥20 | ≥50 | GB/T 7753-87 | |
| 6. Temperature resistance (℃) |
260°C /30mins (No residual glue) | 260°C /30mins (No residual glue) | 260°C /30mins (No residual glue) | 200°C/30mins (No residual glue) | 260°C /30mins (No residual glue) | ||
Customizable styles
1. Polyimide CIRCLES
Primarily used for localized masking and protection in electronic manufacturing, such as:
- precise masking during PCB wave soldering and gold finger spraying (to prevent solder joints/gold fingers from being contaminated);
- protection of specific areas in high-temperature spraying processes (high temperature resistance, easy peeling, and no residue).
2. Polyimide rectangular
It belongs to the category of die-cut custom shapes and is commonly used for:
- fixing and insulating the positive/negative tabs of lithium batteries;
- component masking in SMT (Surface Mount Technology) processes;
- partial insulation wrapping of motor and transformer coils.
3. Polyimide Rolls
Supplied in roll form, suitable for large-area/continuous processing scenarios:
- Coil insulation wrapping for motors and transformers (resistant to high and low temperatures, high insulation level);
- Substrate for flexible printed circuits (FPC);
- High-temperature insulating sleeves for cables.
4. Polyimide Sheets
Suitable for large-area/custom-size insulation/substrate needs:
- Encapsulation substrates for high-temperature heating films (such as heating elements in aerospace/medical equipment);
- Sample support films for X-ray fluorescence spectroscopy (XRF) analysis;
- Structural support and overall protection of gold fingers for flexible circuit boards.
Industries We Serve
Widely used in electronics, automotive, construction, home appliances, packaging, and furniture manufacturing, ensuring strong bonding and reliable performance across industries.
Our Production Equipment
Jiujiang Leadcomp Co., Ltd. has many years of experience in the manufacturing of high-temperature tapes. Our factory is equipped with advanced slitting, die-cutting, and coating equipment, enabling large-scale, precise, and high-quality production. Each roll of tape undergoes rigorous quality control to ensure its reliability and consistency in industrial applications.
Customer Success Stories
Jiujiang Leadcomp Co., Ltd. provides high-quality ODM and OEM tape solutions for numerous industries, customizing die-cut tape products to meet each customer’s unique needs. With years of experience in precision die-cutting, we pride ourselves on advanced processes and attention to detail. The following showcases our superior die-cutting technology and samples, reflecting our relentless pursuit of quality and precision.
Our Certificates
